Taipei, July 14, 2008 (CENS)--Taiwan`s supply chain of Intel Centrino II platform has been speeding up the shipments since the world`s No.1 chipmaker recently announced it would make synchronous rollout of the next-generation computer platform worldwide tomorrow.
Intel has contracted Advanced Semiconductor Engineering (ASE) Inc. and Siliconware Precision Industry Co., Ltd. to package and test chips; Taiwan Semiconductor Manufacturing Co. (TSMC) to make networking-communication chips; Universal Scientific Industrial Co., Ltd., and GemTek Technology Co., Ltd. to supply wireless modules; and Nanya PCB Corp. to supply flip-chip substrate.
Intel originally planned to unveil the platform, dubbed as Montevina, early last month. But some technical problems in graphics core and wireless network have delayed the scheduled introduction. The delay has restrained procurement sentiment in PC market.
People familiar with Intel`s plan pointed out that although Intel has postponed the rollout date, the new platform is estimated to penetrate into 30-40% of notebook computers by the end of this quarter and into 50-60% of the computers in the Christmas shopping season.
Nanya`s production of the substrates for chips used in the platform is running at full capacity, raising the expectation that the company`s revenue for the third quarter will be 10-15% more than the second quarter.
ASE and Siliconware are contracted to package the 65nm wireless chips for the platform with system-in-package (SiP) technology.
Source by news.cens.com
Labels: b2b suppliers, B2b Suppliers news, Supply Chain News
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